Architecture
| Lithography | 10 nm |
|---|---|
| Code Name | Products formerly Ice Lake |
| Product Collection | 3rd Gen Intel® Xeon® Scalable Processors |
| Launch Date | Q2'21 |
| Status | Launched |
| Package Size | 77.5mm x 56.5mm |
Platform Features
Instruction Set Features
Instruction Extensions: Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512.
Virtualization Technology
Thermal Specifications
| Max Case Temperature | 83°C |
|---|
Bus & Memory Interface
| Bus Speed | 2667 MHz |
|---|---|
| QPI Links | 3 |

